The FGM230S is a system-in-package (SiP) module for Proprietary wireless connectivity built for the performance, security, and energy demands of Proprietary applications.
FGM230S delivers robust RF performance, long-range, industry leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package. The FGM230S is a complete solution supported by powerful and fully upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your endproduct, helping to accelerate its time-to-market significantly.
The FGM230S is targeted for a broad range of applications, including: •Metering •Home and Building Automation and Security •Industrial Automation •Street Lighting
KEY FEATURES
• Proprietary uncertified connectivity
• RF pin for external antenna
• +14 dBm TX power
• -109.8 dBm RX sensitivity @100 kbps
• 32-bit ARM Cortex-M33 core at 39 MHz
• 512/64 kB of Flash/RAM memory
• Advanced security features
• Rich set of MCU peripherals
• Integrated DC-DC converter
• 34 GPIO pins
• -40 to 85 °C
• 6.5 mm x 6.5 mm
