Winbond has a long track record of semiconductor production at its own 12” wafer fabrication in Taiwan. The company continues to invest in new process technologies and equipment at its fab. After completing a migration from 46nm and 38nm to the Winbond 25nm and 25Snm process, Winbond do a further migration to 20nm in 2023. Winbond DRAM […]
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IntroductionThe average household has more IoT devices than ever before, and wireless device manufacturers are tasked with keeping up with demand and setting the rules of engagement for emerging technologies. Their efforts in areas like battery life and device security will influence technology adoption today and long into the future. With rapid technological advancement, the variety of connected devices and application
Harnessing the Powerof Wi-Fi 6 in the New Age of IoT Read More »
